🖌️ Crafting made easy—join the revolution!
The Sizzix Wafer Thin Die Brush & Foam Pad is an essential tool for crafters, designed to effortlessly remove excess paper while providing a sleek, ergonomic grip. Weighing just 0.23 pounds and measuring 5.08 x 2.54 x 0.01 cm, this compact tool is perfect for both home and travel, ensuring a clean and efficient crafting experience without the need for assembly.
Product Dimensions | 5.08 x 2.54 x 0.01 cm; 104.33 g |
Item Weight | 0.23 Pounds |
Is assembly required | No |
Number of pieces | 1 |
Batteries required | No |
ترست بايلوت
منذ يومين
منذ أسبوع