Mfr Part Number: AS5-3.5G x 5-> Pack of 5 units. Features: Contains 99.9% pure silver High-Density(contains over 88% thermally conductive filler by weight) Controlled Tripple-Phase Viscosity Not Electrically Conductive and Absolute Stability (will not separate run migrate or bleed). Thermal Conductance: >300000W/m2 C (0.001 inch layer). Thermal Resistance: <0.005C-in2/Watt (0.001 inch layer). Average Particle Size: <0.49 microns 180C Long-Term: 50C to 130C. Performance: 3 to 12 degrees centigrade lower CPU full load core temperatures than standard thermal compounds or thermal pads when measured with a calibrated thermal diode imbedded in the CPU core.. Coverage Area: The 3.5 gram tube contains enough compound to cover at least 15 to 25 small CPU cores or 6 to 10 large CPU cores or 2 to 5 heat plates. At a layer 0.003 thick the 3.5 gram tube will cover approximately 16 square inches.
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منذ أسبوعين