Mix Ratio by weight: 100:10 / Resin:Hardener Substrates: Metals, Many plastics, Glass, and other materials Operating Temperature: -60 to 120 C Typical Applications: ALL types of fiber-optic connectors as well as LED displays, lenses and other optical components. Viscosity @ 25 C: Paste Thixotropic Index: 1.0 Specific Gravity, mixed, g/cc: 2.29 2-4 hours: @ 65C 24 hours: @ 25C Volume Resistivity: 2.10e+15 ohm-cm Dielectric Constant: 5.9 @ Frequency 1000 Hz Dielectric Strength: 16.1 kV/mm 410 kV/in Dissipation Factor: 0.010 @ Frequency 1000 Hz Thermal Conductivity: 6.09 BTU-in/hr-ft-F Hardness, Shore D: 88 Fiber-Optic-Bond 62 Thixotropic Electrical Insulating Epoxy Adhesive System Low Vapor Pressure Outgassing is a thixotropic electrical insulating epoxy adhesive system with low vapor pressure and outgassing characteristics.Fiber-Optic-Bond 62 Thixotropic Electrical Insulating Epoxy Adhesive System Low Vapor Pressure Outgassing was specifically developed for fiber optic, laser, photonic and electronic applications requiring excellent electrical insulation in combination with effective thermal dissipation from heat-producing components.Fiber-Optic-Bond 62 Thixotropic Electrical Insulating Epoxy Adhesive System Low Vapor Pressure Outgassing is two-part epoxy compound develops strong, durable, stable, high impact thermally conductive bonds at room temperature, and adheres readily to itself, and to metals, many plastics, silica, steatite, alumina, sapphire and other ceramics, glass, and to many other materials.Fiber-Optic-Bond 62 Thixotropic Electrical Insulating Epoxy Adhesive System Low Vapor Pressure Outgassing provides excellent resistance to salt solutions, mild acids and alkalis and many other chemicals including petroleum solvents, lubricating oils and alcohol.For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).1) Carefully clean and dry all surfaces to be bonded.2) Apply
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