الوصف
🔥 Stick with the best—cool smarter, bond stronger!
- SAFE SOUND - Non-electrically conductive and non-toxic formula ensures peace of mind for both your devices and workspace.
- ROCK SOLID BONDING - Experience unwavering 2.1 MPA adhesion strength that guarantees a durable, long-lasting connection on metals and non-metals alike.
- FAST TRACK APPLICATION - Cut downtime with a rapid 30-minute curing time—get your tech back in action faster than ever.
- EFFORTLESS HEAT MASTERY - Maximize your device’s lifespan with superior 0.975W/m-K thermal conductivity that keeps critical components cool and efficient.
- EXTREME CONDITIONS READY - Operates flawlessly from -60°C to 250°C, perfect for demanding environments and high-performance electronics.
HY910 Thermal Conductive Glue is a high-performance silicone adhesive designed for efficient heat dissipation in electronic components like GPUs, LEDs, and IC chipsets. Featuring 0.975W/m-K thermal conductivity, strong 2.1 MPA adhesion, and a quick 30-minute drying time, it ensures reliable bonding without electrical conductivity. Safe, odorless, moisture-resistant, and stable across -60°C to 250°C, it’s the go-to solution for professionals seeking durable cooling performance without the hassle.