Description
🔧 Seal the Deal with MAX EPC!
- THERMAL MASTERY - Experience rapid heat dissipation with our advanced thermally conductive formula.
- HEAT CURABLE OPTION - Need speed? Our heat-curable feature allows for faster processing without compromising quality.
- VERSATILE INSULATION - Perfectly insulates both AC and DC currents, accommodating high and low voltage applications.
- EXTENDED WORKING TIME - Enjoy a generous 24-hour working window at 25°C for precision in your projects.
- EFFORTLESS APPLICATION - Lower viscosity means easier mixing and application, saving you time and effort.
MAX EPC Epoxy Potting Compound is a slow-curing, low exothermic solution designed for potting circuit boards. It offers high thermal conductivity, excellent insulation for both AC and DC currents, and a user-friendly application process with a 24-hour curing time at room temperature.
