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3D BGA Reballing Stencil Kit For Motherboard Middle Layer Planting Tin Template Reballing Plate Soldering Net

3D BGA Reballing Stencil Kit For Motherboard Middle Layer Planting Tin Template Reballing Plate Soldering Net

Name: 3D BGA Reballing Stencil Kit For Motherboard Middle Layer Planting Tin Template Reballing Plate Soldering Net
Brand: Hhwj
Price: 8358.15 EGP
Availability: InStock

Product ID: 155816460

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Description

Particle Size:1-10Μm
Usage:Repair For Iphone X
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Particle Size:1-10ΜmUsage:Repair For Iphone X

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TrustScore 4.5 | 7,300+ reviews

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Very impressed with the quality and fast delivery. Will shop here again.

4 days ago

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Excellent communication throughout the order process. Product is perfect.

2 weeks ago

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