3D Microelectronic Packaging: From Architectures to Applications (Springer Series in Advanced Microelectronics, 64)

Name: 3D Microelectronic Packaging: From Architectures to Applications (Springer Series in Advanced Microelectronics, 64)
Brand: Yan Lideepak Goyal
Price: 25616.74 EGP
Availability: InStock

Product ID: 291339229

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3D Microelectronic Packaging: From Architectures to Applications (Springer Series in Advanced Microelectronics, 64)

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